MOS composite static induction thyristor (CSMT or MCS) is a combination of a MOS transistor connected in cascode relation to the SI-thyristor.^[1]
The SI thyristor (SITh) unit has a gate to which a source of MOS transistor is connected through a voltage regulation element. The low conduction loss and rugged structure MCS make it more favorable than conversional IGBT transistors.
In the blocking state nearly the complete voltage drops at the SITh. Thus the MOSFET is not exposed to high field stress. For fast switching the MOSFET with only 30-50 V blocking voltage is able. In IGBT, charge carrier concentration at emitter side in n-base layer is low as holes injected from collector easily pass to emitter electrode through p-base layer. Thus the wide-base pnp transistor operates by virtue of its current gain characteristics causing the rise collector-emitter saturation voltage.

In an MCS the positive difference between the voltage of regulation element and conduction voltage drop of MOSFET is applied to location between the collector region and emitter region of the pnp transistor. Hole concentration is accumulated at emitter side in n-base layer because of impossibility of the hole flow through forward bias collector-base junction of the pnp transistor. Carrier distribution in n-base is similar to that of saturation bipolar transistor and low saturation voltage of MCS, even at high voltage ratings, can be achieved

The metal–oxide–semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET) is a device used for amplifying or switching electronic signals. The basic principle of the device was first proposed by Julius Edgar Lilienfeld in 1925. In MOSFETs, a voltage on the oxide-insulated gate electrode can induce a conducting channel between the two other contacts called source and drain. The channel can be of n-type or p-type (see article on semiconductor devices), and is accordingly called an NMOSFET or a PMOSFET (also commonly nMOS, pMOS). It is by far the most common transistor in both digital and analog circuits, though the bipolar junction transistor was at one time much more common.
The 'metal' in the name is now often a misnomer because the previously metal gate material is now often a layer of polysilicon (polycrystalline silicon). Aluminium had been the gate material until the mid 1970s, when polysilicon became dominant, due to its capability to form self-aligned gates. Metallic gates are regaining popularity, since it is difficult to increase the speed of operation of transistors without metal gates.
IGFET is a related term meaning insulated-gate field-effect transistor, and is almost synonymous with MOSFET, though it can refer to FETs with a gate insulator that is not oxide. Another synonym is MISFET for metal–insulator–semiconductor FET.

Two power MOSFETs in the surface-mount package D2PAK. Operating as switches, each of these components can sustain a blocking voltage of 120 volts in the OFF state, and can conduct a continuous current of 30 amperes in the ON state, dissipating up to about 100 watts and controlling a load of over 2000 watts. A matchstick is pictured for scale.

A cross section through an nMOSFET when the gate voltage V_GS is below the threshold for making a conductive channel; there is little or no conduction between the terminals source and drain; the switch is off. When the gate is more positive, it attracts electrons, inducing an n-type conductive channel in the substrate below the oxide, which allows electrons to flow between the n-doped terminals; the switch is on.

Rooselvet Ramirez    EES